These are multi-layer PCBs in which layers are piled up one by one using laser technology and plating technology after forming a conductor pattern on an insulating layer. Because wiring is possible on the connection part of each layer, this method achieves higher density and higher integration than ordinary multi-layer through-hole PCBs. They are used for devices that require high-density wiring in a limited space.

These support the EMS business

Features

• HDI PCBs with Staggered Via and Stacked Via

• Any combination with Laser Via, IVH or Plated Through Hole is possible

Applications

Cross section

Stackup

Design rule