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TECHNOLOGY | R&D

31th. July 2018

AnyLayer PCB (M-VIA Ⅲ)

002_thumb_01.jpgThese are PCBs that enable free connection between all layers combining laser technology and filled plating technology that allows ultra-fine processing. With the higher degree of design freedom and higher-density wiring, these PCBs are ideal for the needs of downsizing and thinning of smartphones and other high performance devices.

These support the EMS business




Features


  • AnyLayer PCBs with Laser Via and Filled Plating on each layer

  • Thinner 0.4mm pitch CSP by AnyLayer interconnection supported

  • Mass-production of 10-layer M-VIA Ⅲ (AnyLayer PCBs) for mobile devices



Applications



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Cross section



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Stackup




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Design rule



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